Vapour Phase Reflow Oven RF275

The Vapour Phase Model  RF275 is a reflow oven that uses vapour phase to reflow solder circuit boards. Problems that occur with small infrared or convection ovens are a thing of the past. Components with large thermal mass, fine pitch, or with black plastic are easily soldered using this oven. The Vapour Phase oven heats a special liquid to soldering temperature, creating a vapor that coats the circuit board. This vapor heats the circuit board very uniformly to 1 temperature. The uniform heating makes soldering circuit boards with various components very easy. The Vapour phase oven provides a stainless steel container in which the circuit boards are placed on a tray. At the bottom of the kettle is a layer of liquid. The kettle is sealed with a lid. The vapour phase oven heats the liquid according to a pre-programmed profile. A sensor monitors the temperature inside the container. When the circuit board is soldered, the vapour is cooled again against the walls of the oven with powerful fans. The soldering temperature is determined by the chosen vapour phase liquid. The standard liquid is Galden LS230, with which all common leaded and lead-free printed circuit boards can be soldered. The Vapour phase can handle all vapour phase liquids with temperatures between 180 and 240℃. With the touch screen, the soldering process can be started and stopped. During soldering, a graph is displayed with the measured and set temperatures. All values can be logged to an SD Card. Custom soldering profiles can also be created for specific applications or fine-tuning. The Vapour phase oven features multiple safeguards to prevent overheating. A sensor detects if the lid is placed. The Galden liquid is expensive per liter, but its consumption in soldering is very low, so the overall running cost of the Vapour phase oven is low. Highlights Very consistent results due to uniform heating Handles well components that are difficult to solder with other furnaces Overheating of the circuit board is impossible Clear touch screen Custom solder profiles can be created Solder cycle can be logged to SD card as CSV file Specifications Max. PCB length 235 mm Max. PCB width 170 mm Temperature range by choice liquid 180 – 240℃ Duration of soldering cycle 14 minutes Approximate Galden consumption per cycle 2 grams   Included  RF275 Vapour phase Reflow Oven Galden LS230 Power cord Platform for PCBs Liquid dipstick Syringe Manual We recommend that the oven, like conventional ovens, be used only in a well-ventilated room, or with a vapor extractor. 110v US Version available Pros Controlled and uniform soldering temperature Consistent results Components that IR and convection ovens cannot handle are not a problem for this oven 500ml Galden LS230 liquid is included Physical Size of Unit W295 x H295 x D415mm Weight 9.6Kg